MITRE Toolbox for System-in-Package and System-on-Chip Devices


MITRE’s platform of tools for System-in-Package (SiP) and System-on-Chip (SoC) hardware and software enables more efficient ways to harness next generation, industry-leading electronic devices.

Next-generation System-in-Package (SiP) and System-on-Chip (SoC) devices are a collection of integrated circuitries that tightly integrates most or all components of a computer or other electronic system into highly capable, efficient, and small form factor packages. The unprecedented capability of these devices has increased the application development complexity.

MITRE developed a suite of cross-platform tools and infrastructure intellectual property (IP) consisting of embedded software IP, field-programmable gate array IP, and high-speed ethernet IP to accelerate application development and efficiently harness the full capacity of next-generation SiP/SoC devices from industry- leading vendors, including Intel & Xilinx.

For more detailed information on MITRE’s SiP and SoC, or for licensing options, contact the MITRE Technology Transfer Office at